Insulation board processing parts

Product name: insulation board processing parts

Product brand: a heat

Processing custom: product size limit is small, can receive for processing

Summary:

Insulation board by GF (special yarn), the UP (unsaturated resin), low shrinkage additive, MD (packing) and various additives. With electrical insulating properties, mechanical properties, thermal stability, resistance to chemical corrosion, the application scope is quite widespread, mainly in the automotive industry, railway vehicle, electrical industry and communication engineering, sanitary ware, floor materials, explosion-proof electrical equipment enclosure, wireless communications, and other fields.

Application features

1, a variety of forms. Almost all kinds of resin, curing agent, modification agent system can adapt to all kinds of application of form request, ranging from extremely low viscosity to high melting point solid.

2, convenient curing. Choose a variety of different curing agent, epoxy resin system can almost cured at 0 ~ 180 ℃ temperature range.

3, strong adhesive force. Epoxy resin molecular chain in the existence of the inherent polar hydroxyl and ether bond, make its have the very high adhesion strength of various substances. During the curing reaction of epoxy resin of low contractility, produced by the internal stress is small, it also helps to improve the adhesion strength.

4, low contractility. Epoxy resin and curing agent used in the reaction is by direct addition reaction or resin molecules in the ring opening polymerization of epoxy base, there is no water or other volatile by-products sent out. They are compared with those of unsaturated polyester resin and phenolic resin in the process of curing showed low contractility (less than 2%).

5, the mechanical properties. After curing system of epoxy resin with excellent mechanical properties.